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System In Package (SIP) Assembly Engineer, Galway
Client:
Chipright
Location:
Galway, Ireland
Job Category:
Other
EU work permit required:
Yes
Job Reference:
74eff9af01cd
Job Views:
50
Posted:
21.01.2025
Expiry Date:
07.03.2025
Job Description:
System In Package (SIP) Assembly Engineer
The assignment:
1. Defining the package type with the customer and sub-contractor, providing technical support between customer and sub-contractor.
2. Development of Modules, MCM, substrates for new types of packages together with our subcontractor.
3. Manage all package development activities including conceptual design, feasibility study, substrate fabrication, and assembly.
4. Organizing the flow of the volume production assembly.
5. Discussing potential yield and/or reliability issues, conducting failure analysis, and implementing process improvements.
Required knowledge and skills:
1. Master’s degree (or higher) in Electronics, preferably with 3 to 7 years of relevant experience in assembly.
2. Knowledge of assembly manufacturing processes and assembly flow including SMT, die prep, die attach, flip chip, underfilling, wire bonding, molding, singulation, and back-end processes.
3. Familiarity with BGA package substrate technologies.
4. Experience in project-based work.
5. Pro-active and customer-focused, with a strong motivation to work within a team of engineers.
6. Excellent communication skills to work effectively with internal cross-functional teams and overseas suppliers; a good knowledge of English is mandatory.
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