Job Details:
Intel is looking for highly motivated individuals, with strong technical backgrounds, capabilities, and experience to sustain, ramp, and transfer technologies using state-of-the-art equipment, materials, and techniques.
Key Responsibilities:
* Drive rapid continuous improvements in safety, quality, yield, reliability, cost, process stability/capability, and productivity while maintaining rigorous CE and best tool matching within the Intel factory network.
* Sustain and improve the performance and associated systems for F24/F34 and VF Device Parametric matching and excursion prevention.
* Be a key driver of the Factory product Power and Performance roadmap and member/leader of the Performance TMI team to ensure the factory products hit customer specifications required.
Skills Required:
* Problem Solving: Demonstrated experience in rapidly analyzing complex process problems and identifying effective solution paths.
* Teamwork and Partnership: Strong teamwork skills and the ability to build effective partnerships.
* Communication: Excellent written and verbal communication skills, with the ability to summarize and communicate information effectively to influence action at all levels.
* Self-Motivation: A motivated self-starter with the ability to work independently as well as collaboratively in a team environment.
* Flexibility: Maturity and adaptability in facing uncertainties and changing priorities or responsibilities.
* Goal Commitment: Commitment to achieving aggressive goals with a positive, can-do attitude and ability to act with velocity and a strong sense of urgency.
Qualifications:
* Minimum Qualifications: Relevant Bachelor's, Master's, and/or PhD degree in Device Physics, Electronics, Physics, Chemistry, or related technical field. 10 years of related experience.
* The candidate must have a strong understanding and demonstrated application of Device Physics and Process Integration.
Preferred Qualifications:
* Relevant experience in 300mm startup and ramp of advanced logic process technologies; and planning/execution of a yield enhancement roadmap.
* Experience working with Yield Analysis tools (techniques and systems), Process Engineering knowledge, Process Control, device knowledge, materials analysis techniques, and Fault Analysis Layout sensitivities to identify Product Yield issues and drive EOL Yields to Best in Class.
* Knowledge of module tool impacts to defects, inline parametrics, device, and yield through PM life while understanding upstream and downstream impacts to other tools.
* Strong Process flow integration knowledge including understanding of defect formation/evolution, process integrated defect, and yield impacts, demonstrated influence across multifunctional fab groups to drive action to reduce defect density and drive yields higher.
* Experience driving product performance roadmaps working in multi-discipline teams with Process Engineers, Integration Engineers, and Yield Analysis to deliver reliable, cost-effective, and stable/capable products.
* Experience working on process transfers to High Volume Manufacturing Factories, solving complex integrated issues delivering matched yields and product performance.
* Knowledge of yield analysis techniques and systems, understanding of processing techniques (Lithography, Etch, Implant, CMP, CVD, plating, diffusion, thin films, etc), yield engineering data analysis tools, and working knowledge of semiconductor devices.