Senior Researcher in Front-End and Back-End Electronic Packaging.Contract: Full Time/Fixed TermRole DescriptionThe Photonics Packaging and Systems Integration Group at the Tyndall Institute invites applications for the position of Senior Researcher in Front-End and Back-End Electronic Packaging. This role combines front-end and back-end packaging responsibilities, including developing and optimising packaging materials and packaging processes which can be transferred to production through the Pilot Line. A significant aspect of the role is utilising Tyndall's state-of-the-art clean room facilities to develop innovative multilevel interposer technologies, advancing integration capabilities for next-generation systems.The successful candidate will lead efforts in the design, implementation, and scaling of advanced electronic packaging processes while managing research projects, supervising junior staff, and collaborating with academic and industrial stakeholders.Key ResponsibilitiesDevelop and optimise novel packaging materials and components such as interposers for use in chiplet and co-packaged optics applications.Provide technical leadership in electronic packaging and integration, leveraging state-of-the-art cleanroom fabrication and assembly facilities.Transition research outcomes to manufacturing by supporting the group’s Pilot Line initiatives and ensuring scalability and manufacturability of processes.Manage a portfolio of industry and EU-funded projects, ensuring timely delivery of outcomes and effective resource utilisation.Supervise and mentor junior researchers, fostering a collaborative and innovative team environment.Build relationships with stakeholders, including academic collaborators and industry partners, to drive impactful research and development.Prepare detailed technical reports and publications on research outcomes.Ensure compliance with organisational Quality Management Systems, Health and Safety standards, and other regulations.Essential CriteriaPhD qualified with typically six years academic and/or industrial experience in photonics, electronics, or a closely related field.Extensive expertise in packaging technologies, including bonding, optical fibre alignment, MEMS packaging, and chip-to-chip bonding.Experience in advanced flip-chip bonding techniques, including fine-pitch bonding for high-volume production environments.Experience in advanced semiconductor fabrication techniques, including MEMs component fabrication.Proven ability to manage complex research projects in both industry and EU contexts.A demonstrated ability to collaborate effectively within interdisciplinary teams.Demonstrate success in winning or contributing to competitive project funding calls.Strong communication skills, with experience presenting research at conferences and engaging with stakeholders.Desirable CriteriaEvidence of entrepreneurial experience and creative skills/creativityExperience in transitioning research outcomes to manufacturing, including early-stage or pilot manufacturing environments.Familiarity with equipment optimisation for packaging processes.Initial experience in securing external funding from public or private sources.Evidence of creative problem-solving and innovation in packaging technologies.Knowledge of project costing, contract negotiation, and preparing project statements of work.Tyndall National institute has a proactive entrepreneurial culture and we welcome applications from candidates who possess entrepreneurial and creative skills/experience, including the creation of technology start-ups.Appointment may be made on the Admin Grade 6A Scale B (new entrants) salary scale €69,932 – €88,584 per annum. Salary placement on appointment will be in accordance with public sector pay policy.Informal enquiries can be made in confidence to Peter O’Brien.Closing date for applications for this position is 18th March, 2025.Application InstructionsPlease make sure to attach an up to date CV/Resume AND a brief motivation letter outlining how you meet the ‘Essential Criteria’ for this role.A full candidate information pack is available to download by clicking here.Please note that Garda vetting and/or an international police clearance check may form part of the selection process.Please note that an appointment to posts advertised will be dependent on University approval, together with the terms of the employment control framework for the higher education sector.At this time, Tyndall National Institute does not require the assistance of recruitment agencies.Tyndall National Institute at University College, Cork is an Equal Opportunities Employer