Job Summary
Fab Sort Manufacturing (FSM) is responsible for the production of all Intel silicon using some of the world's most advanced manufacturing processes in fabs in Arizona, Ireland, Israel, Oregon and new greenfield site in Ohio.
As part of Intel's Integrated Device Manufacturer 2.0 (IDM2.0) strategy, FSM is rapidly expanding its operation to deliver output for both internal and foundry customers with state-of-the-art technologies arriving in high-volume manufacturing at a 2-year cadence going forward.
Intel recently created a High-Volume Manufacturing (HVM) Global Yield organization in FSM to strengthen its yield operation and enable fast-paced yield ramp-up in early HVM phases for each technology in collaboration with Technology Development team and FSM fab managers.
This job requisition is to seek Yield Analysis engineers for our FSM / HVM Global Yield organization, reporting to the YA team manager.
Responsibilities:
* Own engineering projects involving large-scale data analysis and machine learning to support HVM yield roadmap, device targeting and attaining performance targets.
* Work with Program Managers, Process Integration, Device and Defect Reduction team members to identify root cause of systematic yield/performance issues and propose mitigation plan in defined timeline to meet committed production yield/performance targets and to support fast paced yield ramp-up in high-volume manufacturing phases.
* Work with Yield Modeling team to develop new yield analysis methods and algorithms to deliver world class yield analytics.
* Formulate yield problems mathematically, identify solutions, and remove technical barriers to achieve successful solutions.
* Provide yield analysis for various engineering projects to improve quality, performance and to reduce wafer cost.
* Engineering support for technical interactions with internal and external customers.
Requirements:
* Bachelor's degree in one of the following disciplines: Electrical/Electronic Engineering, Physics, Chemistry, Materials Science, or in a (STEM) related major.
* Experience in python and other program languages to develop a new analysis method and algorithms using large amount of fab data.
* Experience in big data analysis and machine learning.
* Experience in advanced node semiconductor high-volume manufacturing.
* Experience with Device Physics and overall FinFET process flow.
Preferred Qualifications:
* Advanced degree (Master's or Ph.D.) in one of the following disciplines: Electrical/Electronic Engineering, Physics, Chemistry, Materials Science, or in a (STEM) related major.
* 2+ year of experience in advanced node semiconductor industry in yield analysis and data science.
* Work experience in TFT environment.
* Experience in new semiconductor technology development.
* Experience in module processes including lithography, dry etch, wet etch, CMP, diffusion, implant, thin films and process integration.