Senior Engineer – Photonic Packaging Equipment and Process Development
This is a challenging role for an experienced engineer who wants to make a significant impact in the field of photonic packaging.
The Photonics Packaging and Systems Integration Group at the Tyndall Institute is looking for a Senior Engineer to lead the development of photonic packaging equipment and processes. The successful candidate will play a key role in advancing photonic packaging processes with a strong emphasis on automation, scaling, and supporting the group's Pilot Line initiatives.
The main responsibilities of this role include:
* Providing technical leadership in photonic packaging, with an emphasis on automation, scaling, process innovation, and transitioning research to manufacturing.
* Designing, developing, and implementing advanced packaging tools and automated equipment for photonic systems.
* Developing strategies to support the Pilot Line by bridging research and manufacturing, ensuring processes are scalable and manufacturable.
* Managing a portfolio of technical projects and ensuring timely project outcomes, with support and mentorship to develop advanced project management skills.
* Initiating and securing new project funding, including public and private sources, as a developmental goal.
* Building a dedicated research team over time, fostering an innovative and collaborative environment.
* Supporting and mentoring researchers within the group, progressively developing team-building and leadership skills.
* Building relationships with project stakeholders, including academic and industry partners, and gaining experience in fostering collaborations and managing partnerships.
* Participating in Education and Public Engagement activities, as required.
* Ensuring compliance with organisational Quality Management Systems, Health and Safety standards, and other regulations.
* To carry out any additional duties that may reasonably be required within the general scope and level of the post.
Essential Criteria:
* A PhD qualification with typically six years academic and/or industrial experience.
* Extensive expertise in photonic packaging processes, including laser reflow, automation and scaling, with significant accomplishments in designing and implementing innovative packaging routines and developing automated tools.
* A proven ability to manage complex technical projects and drive impactful research, as demonstrated by successful outcomes in academic or industrial contexts.
* Experience managing technical projects in the fields of photonics and electronics, with a willingness to develop further project leadership skills.
* A passion for building a research team, with an openness to mentoring and leading others over time.
* Excellent communication skills, including presenting research at conferences and industry events, with an eagerness to expand in this area.
Desirable Criteria:
* Evidence of entrepreneurial experience and creative skills/creativity.
* Industry experience using advanced packaging equipment.
* Industry experience developing new advanced packaging equipment.
* Familiarity with integrated photonics and microelectronics applications, particularly in a research or industrial context.
* Initial experience in proposal writing and securing funds from public or private sources, with an ambition to expand these skills.
* A basic understanding of project costing, contract negotiation, and preparing project statements of work, with support available to grow in these areas.
* Evidence of creative thinking and innovation in photonic packaging research.